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PAMS
Technical Documentation
SIM Card Connector
Pin
Name
Parameter
4
GND
GND
3, 5
VSIM
5V SIM Card
3V SIM Card
6
DATA
5V Vin/Vout
3V Vin/Vout
2
SIMRST
5V SIM Card
3V SIM Card
1
SIMCLK
Frequency
Trise/Tfall
Internal Microphone
Pin
Name
Min
6
MICP
7
MICN
Infrared Module Connections
An infrared transceiver module is designed to substitute an electrical
cable between the phone and a PC. The infrared transceiver module is a
stand alone component capable to perform infrared transmitting and re-
ceiving functions by transforming signals transmitted in infrared light from
and to electrical data pulses running in two wire asyncronous databus. In
DCT3 the module is placed inside the phone at the top of the phone.
Signal
Parameter
IRON
IR–module on/off
FBUS_RX
IR receive pulse
IR receive no pulse
FBUS_TX
IR transmit pulse
IR transmit no pulse
Original 11/97
Min
Typ
Max
0
4.8
5.0
5.2
2.8
3.0
3.2
4.0
"1"
VSIM
0
"0"
0.5
2.8
"1"
VSIM
0
"0"
0.5
4.0
"1"
VSIM
2.8
"1"
VSIM
3.25
25
Typ
Max
Unit
0.55
4.1
mV
0.55
4.1
mV
Min
Typ
2.0
0
2.0
2.0
0
System Module
Unit
0
V
V
Supply voltage
V
SIM data
Trise/Tfall max 1us
V
SIM reset
MHz
SIM clock
ns
Notes
Connected to COBBA MIC2N input. The
maximum value corresponds to1 kHz, 0
dBmO network level with input amplifier
gain set to 32 dB. typical value is maxi-
mum value – 16 dB.
Connected to COBBA MIC2P input. The
maximum value corresponds to1 kHz, 0
dBmO network level with input amplifier
gain set to 32 dB. typical value is maxi-
mum value – 16 dB.
Max
Unit
2.85
V
Iout@2mA
0.8
V
2.85
V
2.85
V
Iout@2mA
0.5
V
NSE–3
Notes
Ground
Notes
Page 3 – 15
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