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Summary of Contents for Lenovo 11KC000XGE
- Page 1 M75t Gen 2 Hardware Maintenance Manual...
- Page 2 Second Edition (June 2021) © Copyright Lenovo 2021. LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered pursuant to a General Services Administration “GSA” contract, use, reproduction, or disclosure is subject to restrictions set forth in Contract No. GS-...
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Page 3: Table Of Contents
Diagnostics ....Handling electrostatic discharge-sensitive Lenovo diagnostic tools ..devices ....4 UEFI diagnostic program . - Page 4 Chapter 7. Notices and Heat sink and fan assembly ..trademarks ....83 Microprocessor ... . . System board .
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Page 5: About This Manual
Important: This manual is intended only for trained service technicians who are familiar with ThinkCentre computers. Use this manual along with the advanced diagnostic tests to troubleshoot problems effectively. Before servicing a ThinkCentre computer, be sure to read and understand Chapter 1 “Important safety information” on page 1. © Copyright Lenovo 2021... - Page 6 M75t Gen 2 Hardware Maintenance Manual...
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Page 7: Chapter 1. Important Safety Information
Avoid contact with hot components inside the computer. During operation, some components become hot enough to burn the skin. Before you open the computer cover, turn off the computer, disconnect power, and wait approximately 10 minutes for the components to cool. © Copyright Lenovo 2021... -
Page 8: Electrical Safety
Electrical safety CAUTION: Electrical current from power, telephone, and communication cables can be hazardous. To avoid personal injury or equipment damage, disconnect the attached power cords, telecommunication systems, networks, and modems before you open the computer covers, unless instructed otherwise in the installation and configuration procedures. -
Page 9: Safety Inspection Guide
• Do not service the following parts with the power on when they are removed from their normal operating places in a machine: – Power supply units – Pumps – Blowers and fans – Motor generators and similar units. (This practice ensures correct grounding of the units.) •... -
Page 10: Handling Electrostatic Discharge-Sensitive Devices
8. Check that the power-supply cover fasteners (screws or rivets) have not been removed or tampered with. Handling electrostatic discharge-sensitive devices Any computer part containing transistors or integrated circuits (ICs) should be considered sensitive to electrostatic discharge (ESD). ESD damage can occur when there is a difference in charge between objects. Protect against ESD damage by equalizing the charge so that the machine, the part, the work mat, and the person handling the part are all at the same charge. - Page 11 • Italian • Korean • Spanish DANGER Electrical current from power, telephone and communication cables is hazardous. To avoid a shock hazard: • Do not connect or disconnect any cables or perform installation, maintenance, or reconfiguration of this product during an electrical storm. •...
- Page 12 CAUTION: When laser products (such as CD-ROMs, DVD-ROM drives, fiber optic devices, or transmitters) are installed, note the following: • Do not remove the covers. Removing the covers of the laser product could result in exposure to hazardous laser radiation. There are no serviceable parts inside the device. •...
- Page 13 Chapter 1 Important safety information...
- Page 14 ≥18 kg (37 lb) ≥32 kg (70.5 lb) ≥55 kg (121.2 lb) M75t Gen 2 Hardware Maintenance Manual...
- Page 15 PERIGO A corrente elétrica proveniente de cabos de alimentação, de telefone e de comunicações é perigosa. Para evitar risco de choque elétrico: • Não conecte nem desconecte nenhum cabo ou execute instalação, manutenção ou reconfiguração deste produto durante uma tempestade com raios. •...
- Page 16 Quando produtos a laser (como unidades de CD-ROMs, unidades de DVD-ROM, dispositivos de fibra ótica ou transmissores) estiverem instalados, observe o seguinte: • Não remova as tampas. A remoção das tampas de um produto a laser pode resultar em exposição prejudicial à...
- Page 17 Chapter 1 Important safety information...
- Page 18 M75t Gen 2 Hardware Maintenance Manual...
- Page 19 Chapter 1 Important safety information...
- Page 20 DANGER Le courant électrique provenant de l'alimentation, du téléphone et des câbles de transmission peut présenter un danger. Pour éviter tout risque de choc électrique : • Ne manipulez aucun câble et n'effectuez aucune opération d'installation, d'entretien ou de reconfiguration de ce produit au cours d'un orage.
- Page 21 Connexion Déconnexion 1. Mettez les unités HORS TENSION. 1. Mettez les unités HORS TENSION. 2. Commencez par brancher tous les cordons sur les 2. Débranchez les cordons d'alimentation des prises. unités. 3. Débranchez les câbles d'interface des connecteurs. 3. Branchez les câbles d'interface sur des 4.
- Page 22 ≥18 kg (37 lb) ≥32 kg (70.5 lb) ≥55 kg (121.2 lb) ATTENTION: Soulevez la machine avec précaution. ATTENTION: L'interrupteur de contrôle d'alimentation de l'unité et l'interrupteur dubloc d'alimentation ne coupent pas le courant électrique alimentantl'unité. En outre, le système peut être équipé de plusieurs cordonsd'alimentation.
- Page 23 • Die Verbindung zu den angeschlossenen Netzkabeln, Telekommunikationssystemen, Netzwerken und Modems ist vor dem Öffnen des Gehäuses zu unterbrechen, sofern in den Installations- und Konfigurationsprozeduren keine anders lautenden Anweisungen enthalten sind. • Zum Installieren, Transportieren und Öffnen der Abdeckungen des Computers oder der angeschlossenen Einheiten die Kabel gemäß...
- Page 24 Laserstrahlung bei geöffneter Verkleidung. Nicht in den Strahl blicken. Keine Lupen oder Spiegel verwenden. Strahlungsbereich meiden. ≥18 kg ≥32 kg ≥55 kg ACHTUNG: Arbeitsschutzrichtlinien beim Anheben der Maschine beachten. ACHTUNG: Mit dem Netzschalter an der Einheit und am Netzteil wird die Stromversorgung für die Einheit nicht unterbrochen.
- Page 25 Chapter 1 Important safety information...
- Page 26 PERICOLO La corrente elettrica proveniente dai cavi di alimentazione, del telefono e di comunicazione può essere pericolosa. Per evitare il rischio di scosse elettriche: M75t Gen 2 Hardware Maintenance Manual...
- Page 27 • Non collegare o scollegare qualsiasi cavo oppure effettuare l'installazione, la manutenzione o la riconfigurazione del prodotto durante un temporale. • Collegare tutti i fili elettrici a una presa di alimentazione correttamente cablata e dotata di messa a terra. • Collegare alle prese elettriche appropriate tutte le apparecchiature che verranno utilizzate per questo prodotto.
- Page 28 • Non rimuovere gli sportelli. L'apertura di un'unità laser può determinare l'esposizione a radiazioni laser pericolose. All'interno dell'unità non vi sono parti su cui effettuare l'assistenza tecnica. • L'utilizzo di controlli, regolazioni o l'esecuzione di procedure non descritti nel presente manuale possono provocare l'esposizione a radiazioni pericolose.
- Page 29 Chapter 1 Important safety information...
- Page 30 PELIGRO La corriente eléctrica procedente de cables de alimentación, teléfonos y cables de comunicación puede ser peligrosa. Para evitar el riesgo de descarga eléctrica: • No conecte ni desconecte los cables ni realice ninguna tarea de instalación, mantenimiento o reconfiguración de este producto durante una tormenta eléctrica. •...
- Page 31 • No encienda nunca un equipo cuando hay señales de fuego, agua o daños estructurales. • Desconecte los cables de alimentación, los sistemas de telecomunicaciones, las redes y los módems conectados antes de abrir las cubiertas de los dispositivos, a menos que se indique lo contrario en los procedimientos de instalación y configuración.
- Page 32 Algunos productos láser tienen incorporado un diodo láser de clase 3A o clase 3B. Tenga en cuenta lo siguiente: Cuando se abre, queda expuesto a radiación láser. No mire directamente al rayo láser, ni siquiera con instrumentos ópticos, y evite exponerse directamente al rayo láser. ≥18 kg ≥32 kg ≥55 kg...
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Page 33: Chapter 2. Important Service Information
• Do not drop a system board or apply any excessive force to it. • Avoid rough handling of any kind. • Avoid bending a system board and hard pushing to prevent cracking at each Ball Grid Array (BGA) chipset. © Copyright Lenovo 2021... -
Page 34: How To Use Error Codes
Dynamic Configure To Order (CTO) model This model provides the ability for a customer to configure a Lenovo solution from a Web site, and have this configuration sent to fulfillment, where it is built and shipped directly to the customer. The machine label and eSupport will load these products as the 4-character MT, 4-character model, and 2-character country code. -
Page 35: Chapter 3. Product Overview
5. Storage drive activity indicator 6. ThinkCentre 7. Microphone connector 8. Headset connector ™ 9. USB-C (3.2 Gen 1) connector 10. USB 3.2 connectors Gen 1 11. USB 3.2 connectors Gen 2 12. Internal speaker * for selected models © Copyright Lenovo 2021... -
Page 36: Rear
Rear ® 1. Audio line-out connector 2. DisplayPort out connectors ™ 3. HDMI out connector 4. USB 2.0 connectors 5. USB 2.0 connector (with smart power-on feature) 6. Power cord connector 7. Smart cable clip slots 8. Serial connector 9. Ethernet connector 10. -
Page 37: Chapter 4. Service Checkout And Symptom-To-Fru Index
• Machine type and model • Processor or hard disk drive upgrades • Failure symptom – Do diagnostics indicate a failure? – What, when, where, single, or multiple systems? – Is the failure repeatable? – Has this configuration ever worked? © Copyright Lenovo 2021... -
Page 38: Symptom-To-Fru Index
– If it has been working, what changes were made prior to its failing? – Is this the original reported failure? • Diagnostics version – Type and version level • Hardware configuration – Print (print screen) configuration currently in use –... -
Page 39: Power Supply Problems
Error FRU/Action The boot sector on the startup drive is corrupted. The drive must be formatted. Do the following: 1. Attempt to back up the data on the failing hard disk drive. 2. Using the operating system programs, format the hard disk drive. -
Page 40: Post Error Codes
POST error codes Each time you turn on the system, it performs a series of tests that check the operation of the system and some options. This series of tests are called the Power-On Self-Test, or POST. POST checks the following operations: •... - Page 41 Message/Symptom FRU/Action Computer will not RPL from server 1. Ensure that the network is in startup sequence as the first device or the first device after diskette. 2. Ensure that the network adapter is enabled for RPL. 3. Network adapter (Advise network administrator of new MAC address) ®...
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Page 42: Undetermined Problems
Message/Symptom FRU/Action Power-on indicator or hard disk drive in-use light not on, 1. Power switch/LED assembly but computer works correctly 2. System Board Printer problems 1. Printer 2. System Board Program loads from the hard disk with a known-good 1. Run the Setup Utility program and check the Startup diagnostics diskette in the first 3.5-inch diskette drive sequence. - Page 43 e. External Cache f. External Cache RAM g. Hard disk drive h. Diskette drive 3. Turn on the computer to retest the system. 4. Repeat steps 1 through 3 until you find the failing device or adapter. If all devices and adapters have been removed, and the problem continues, replace the system board. See Chapter 6 “Hardware removal and installation”...
- Page 44 M75t Gen 2 Hardware Maintenance Manual...
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Page 45: Chapter 5. Troubleshooting, Diagnostics, And Recovery
4. Run the diagnostic program. See “Diagnostics” on page 47. 5. Recover your operating system. See “Recovery” on page 48. 6. If the problem persists, contact Lenovo. Troubleshooting Use the troubleshooting information to find solutions to problems that have definite symptoms. -
Page 46: Startup Problems
Startup problems Problem Solution • Ensure that the power cord is correctly connected to the rear of the computer and to a working electrical outlet. • If the computer has a secondary power switch on the rear of the The computer does not start up when you computer, ensure that it is switched on. -
Page 47: Audio Problems
Audio problems Problem Solution • If you are using powered external speakers that have an On/Off control, ensure that: – The On/Off control is set to the On position. – The speaker power cable is connected to a properly grounded, functional ac electrical outlet. - Page 48 Problem Solution • Connect the cable from the Ethernet connector to the RJ45 connector of the hub. • Enable the Ethernet LAN feature in UEFI BIOS. • Enable the Ethernet LAN adapter. 1. Go to Control Panel and view by large icons or small icons. 2.
- Page 49 Problem Solution • Enable the Bluetooth feature in UEFI BIOS. • Enable all Bluetooth devices. 1. Right-click the Start button to open the Start context menu. 2. Click Device Manager. Type the administrator password or provide confirmation if prompted. 3. Expand Bluetooth to display all Bluetooth devices. Right-click each Bluetooth device, and then click Enable device.
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Page 50: Performance Problems
Performance problems Problem Solution Note: Depending on the volume of the storage drives and amount of data stored on the storage drives, the disk-defragmentation process might take up to several hours. 1. Close any open programs and windows. 2. Open the Start menu. Excessive fragmented files exist on the 3. -
Page 51: Storage Drive Problems
Storage drive problems Problem Solution • Ensure that the signal cables and power cables for all the storage drives are connected correctly. • Ensure that the computer is configured correctly to support the storage drives. Some or all storage drives are missing from –... -
Page 52: Serial Connector Problems
Problem Solution • Disable any background programs, such as AntiVirus or Desktop The playback is slow or choppy. Themes. • Ensure that video resolution is less than 1152 x 864 pixels. • Ensure that the disc is in the drive with the shiny side of the disc facing down. -
Page 53: Software Problems
Use diagnostic solutions to test hardware components and report operating-system-controlled settings that interfere with the correct operation of your computer. Lenovo diagnostic tools For information about Lenovo diagnostic tools, go to: https://pcsupport.lenovo.com/lenovodiagnosticsolutions UEFI diagnostic program A UEFI diagnostic program is preinstalled on the computer. It enables you to test memory modules and internal storage devices, view system information, and check and recover bad sectors on internal storage devices. -
Page 54: Recovery
Table 1. Options on the main screen of the UEFI diagnostic program DIAGNOSTICS TOOLS • CPU [U] • SYSTEM INFORMATION [F1] • DISPLAY [D] • BAD BLOCK RECOVERY [F3] • MEMORY [E] • SMART INFORMATION [F5] • MOTHERBOARD [H] • PCI EXPRESS [P] •... -
Page 55: Windows Automatic Recovery
Windows recovery programs are damaged. If you did not create a recovery USB drive as a precautionary measure, you can contact Lenovo Customer Support Center and purchase one from Lenovo. For a list of the Lenovo Support phone numbers for your country or region, go to: https://pcsupport.lenovo.com/supportphonelist Create a recovery USB drive Attention: The creation process deletes anything stored on the USB drive. - Page 56 • From Windows Update: Note: The device drivers provided by Windows Update might not be tested by Lenovo. It is recommended that you get device drivers from Lenovo. 1. Open the Start menu.
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Page 57: Chapter 6. Hardware Removal And Installation
Common tool Isolated tweezers Common tool Hexagonal socket Common tool Silicone grease Consumable tool Polyamide tape Consumable tool Mylar tape Consumable tool Eraser Consumable tool Electrical tape Consumable tool Double-sided tape Consumable tool Conductive tape Consumable tool © Copyright Lenovo 2021... -
Page 58: Major Frus And Crus
Note: The silicone grease can be applied to the surfaces of the microprocessor and heat sink to eliminate air gaps. The hexagonal socket is used to pick up the antenna connectors. Major FRUs and CRUs Your computer contains the following types of CRUs and FRUs: •... - Page 59 Number Description Self-service CRU Optional-service CRU Heat sink and fan assembly Memory module Microprocessor System board Chapter 6 Hardware removal and installation...
- Page 60 Number Description Self-service CRU Optional-service CRU Coin-cell battery Wi-Fi card* Wi-Fi card shield* M.2 solid-state drive* M.2 solid-state drive bracket* Heat sink and M.2 solid-state drive thermal pad* Heat sink and M.2 solid-state drive thermal pad* Cover presence switch Card reader* Card reader bracket* Chassis Front I/O bracket...
- Page 61 For detailed FRU and CRU information, such as the FRU part numbers and supported computer models, go http://www.lenovo.com/serviceparts-lookup Chapter 6 Hardware removal and installation...
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Page 62: System Board
System board 4-pin power connector Microprocessor socket Microprocessor fan connector Memory slot (DIMM1) Memory slot (DIMM2) Memory slot (DIMM3) Memory slot (DIMM4) Auxiliary fan connector 2 Power button connector Internal speaker connector 10-pin power connector SATA power connectors Auxiliary fan connector 1 SATA 3.0 connectors Buzzer M.2 solid-state drive slot... -
Page 63: Removing And Installing Hardware
Removing and installing hardware This section provides instructions on how to remove and install hardware for your computer. You can expand the capabilities of your computer and maintain your computer by removing or installing hardware. Attention: Do not open your computer or attempt any repair before reading and understanding the Chapter 1 “Important safety information”... -
Page 64: Optical Drive
Optical drive Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. For access, do the following: 1. Remove the following parts in order: • “” on page • “Front bezel” on page 57 2. -
Page 65: Drive Bay Assembly
Drive bay assembly Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. For access, remove the following parts in order: • “” on page • “Front bezel” on page 57 Chapter 6 Hardware removal and installation... -
Page 66: Hard Disk Drive
Replacement procedure Hard disk drive Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. Attention: The internal storage drive is sensitive. Inappropriate handling might cause damage and permanent loss of data. When handling the internal storage drive, observe the following guidelines: •... - Page 67 • Do not touch the contact edge of the internal storage drive. Otherwise, the internal storage drive might get damaged. • Do not apply pressure to the internal storage drive. • Do not make the internal storage drive subject to physical shocks or vibration. Put the internal storage drive on a soft material, such as cloth, to absorb physical shocks.
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Page 68: M.2 Solid-State Drive And Heat Sink
Removal steps M.2 solid-state drive and heat sink Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. The heat sink might be very hot. Before you open the computer cover, turn off the computer and wait several minutes until the computer is cool. - Page 69 • For computers without the heat sink for the M.2 solid-state drive, do the following: • For computers with the heat sink for the M.2 solid-state drive, do one of the following depending on the computer model: – Type 1 Note: When installing the M.2 solid-state drive and the heat sink, remove the film (if any) that covers the thermal pad.
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Page 70: M.2 Solid-State Drive Bracket
– Type 2 Note: When installing the M.2 solid-state drive and the heat sink, remove the film (if any) that covers the thermal pad. M.2 solid-state drive bracket Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. -
Page 71: Memory Module
Memory module Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. Ensure that you follow the installation order for memory modules shown in the following illustration. For access, remove the following parts in order: •... -
Page 72: Pci-Express Card
Note: During the installation, ensure that you align the memory module to the slot and press down on both ends until the latches are fully engaged with a click. PCI-Express card Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. -
Page 73: Coin-Cell Battery
Note: During the installation, ensure that you align the PCI-Express card to the slot and press down until the latch is fully engaged with a click. Coin-cell battery Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. -
Page 74: E-Lock
Removal steps Note: After installing a new coin-cell battery, reset the system date and time in the UEFI BIOS menu. E-lock Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. Note: To remove the screws, you need a special tool (T15 star wrench). For access, do the following: 1. -
Page 75: Power Supply Assembly
Power supply assembly Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. Before you open the computer cover, turn off the computer and wait several minutes until the computer is cool. Although there are no moving parts in the computer after the power cord has been disconnected, the following warnings are required for your safety. -
Page 76: Wi-Fi Card
Wi-Fi Card Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. For access, remove the following parts in order: • “” on page • “Front bezel” on page 57 • “Drive bay assembly” on page 59 Removal steps Note: During installation, ensure that you connect the gray cable to the connector labeled AUX on the card, and the black cable to the connector labeled MAIN. -
Page 77: Front I/O Bracket
Removal steps CAUTION: Touch only the edges of the card reader. Do not touch the card reader’s circuit board. Front I/O bracket Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. For access, do the following: 1. - Page 78 Replacement procedure M75t Gen 2 Hardware Maintenance Manual...
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Page 79: Thermal Sensor
Thermal sensor Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. For access, do the following: 1. Remove the following parts in order: • “” on page • “Front bezel” on page 57 •... -
Page 80: Front Fan
Front fan Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. For access, do the following: 1. Remove the following parts in order: • “” on page • “Front bezel” on page 57 •... -
Page 81: Wi-Fi Antenna And Cable
For access, do the following: 1. Remove the following parts in order: • “” on page • “Front bezel” on page 57 • “Drive bay assembly” on page 59 2. Disconnect the rear fan cable from the system board. Replacement procedure Wi-Fi antenna and cable Prerequisite Before you start, read Chapter 1 “Important safety information”... - Page 82 • “Front bezel” on page 57 • “Drive bay assembly” on page 59 2. Disconnect the front Wi-Fi antenna cable from the Wi-Fi card. See “Wi-Fi Card” on page 70. Removal steps Rear Wi-Fi antenna and cable For access, do the following: 1.
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Page 83: Cover Presence Switch
Cover presence switch Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. For access, do the following: 1. Remove the computer cover. See “” on page . 2. Disconnect the cover presence switch cable from the system board. Chapter 6 Hardware removal and installation... - Page 84 Removal steps Heat sink and fan assembly Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. CAUTION: The heat sink and fan assembly might be very hot. Before you open the computer cover, turn off the computer and wait several minutes until the computer is cool.
- Page 85 Removal steps Microprocessor Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. CAUTION: The heat sink and microprocessor might be very hot. Before you open the computer cover, turn off the computer and wait several minutes until the computer is cool.
- Page 86 Removal steps System board Prerequisite Before you start, read Chapter 1 “Important safety information” on page 1 and print the following instructions. The heat sink and microprocessor might be very hot. Before you open the computer cover, turn off the computer and wait several minutes until the computer is cool.
- Page 87 Removal steps Note: Handle the system board carefully by its edges. Notes: • For computers with RX550X GFX, ensure that a new VR heat sink is installed when you replace the system board. • The failing system board must be returned with a microprocessor socket cover to protect the pins during shipping and handling.
- Page 88 M75t Gen 2 Hardware Maintenance Manual...
- Page 89 Lenovo representative for information on the products and services currently available in your area. Any reference to a Lenovo product, program, or service is not intended to state or imply that only that Lenovo product, program, or service may be used. Any functionally equivalent product, program, or service that does not infringe any Lenovo intellectual property right may be used instead.
- Page 90 Actual results may vary. Users of this document should verify the applicable data for their specific environment. This document is copyrighted by Lenovo and is not covered by any open source license, including any Linux agreement(s) which may accompany software included with this product. Lenovo may update this document at any time without notice.