1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video, Information Technology and Communication Technology. Lenovo assumes that you are qualified in the servicing of equipment and trained in recognizing hazards energy levels in products. Access to the equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the authority responsible for the location.
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0.1 ohm or less between the external ground pin and the frame ground. • Make sure that the insulation is not frayed or worn. 3. Check for any obvious non-Lenovo alterations. Use good judgment as to the safety of any non-Lenovo alterations.
Figure 1. ThinkSystem HS350X V3 Security advisories In order to protect our customers and their data, Lenovo is committed to developing products and services that adhere to the highest security standards. When potential vulnerabilities are reported, it is the responsibility of the Lenovo Product Security Incident Response Team (PSIRT) to investigate and provide information to our customers so that they may put mitigation plans in place as we work toward providing solutions.
• Minimum memory: 32 GB • Maximum memory: 1 TB: 16 x 64 GB RDIMMs Internal drives Internal drives Front: • 24 3.5-inch hot-swap SAS/SATA drives Rear: • Up to two 2.5-inch hot-swap NVMe drives ThinkSystem HS350X V3 User Guide...
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Expansion slots Expansion slots Depending on the model, your server supports up to three PCIe slots in the rear. • Riser 1: – PCIe x8, Gen 4, full-height, half-length – PCIe x16, Gen 4, full-height, half-length • Riser 2: – PCIe x16, Gen 4, half-height, half-length Integrated functions and I/O connectors Integrated functions and I/O connectors •...
• Support with limitations: – Rocky Linux 8.8 – Rocky Linux 9.2 Mechanical specifications Summary of the mechanical specifications of the server. Depending on the model, some features might not be available, or some specifications might not apply. ThinkSystem HS350X V3 User Guide...
Dimension 2U server • Height: 86.80 mm (3.42 inches) • Width: – With rack latches: 481.00 mm (18.94 inches) – Without rack latches: 447.00 mm (17.60 inches) • Depth: – With rack latches: 855.60 mm (33.69 inches) – Without rack latches: 812.00 mm (31.97 inches) Weight •...
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Lenovo recommends that you consult with qualified experts in this field to determine whether you are in compliance with the applicable regulations.
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Ambient temperature management Ambient temperature management The server is supported in the following environment: • Air temperature: – Operating: – ASHRAE class H1: 5–25°C (41–77°F); when the altitude exceeds 900 m (2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F) with every 500 m (1640 ft) of altitude increase. –...
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If Lenovo determines that the levels of particulates or gases in your environment have caused damage to the device, Lenovo may condition provision of repair or replacement of devices or parts on implementation of appropriate remedial measures to mitigate such environmental contamination.
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Table 3. Limits for particulates and gases Contaminant Limits Reactive gases Severity level G1 as per ANSI/ISA 71.04-1985 • The copper reactivity level shall be less than 200 Angstroms per month (Å/month ≈ 0.0035 μg/ -hour weight gain). • The silver reactivity level shall be less than 200 Angstroms per month (Å/month ≈ 0.0035 μg/ -hour weight gain).
Figure 3. OCP module (two connectors) The OCP module provides two Ethernet connectors for network connections. By default, any Ethernet connector on the OCP module can also function as a management connector using the shared management capacity. ThinkSystem HS350X V3 User Guide...
Hot-swap drives and drive bays The drive bays on the front and rear of your server are designed for hot-swap drives. When you install drives, follow the order of the drive bay numbers. The EMI integrity and cooling of the server are protected by having all drive bays occupied. PCIe slots The PCIe slots are on the rear of the server and your server supports up to three PCIe slots on riser 1 and 2 assemblies.
PIB power connector 1 VROC key connector DC-SCM slot PIB power connector 0 Front panel connector Front BP power connector 3 System board handle NVMe M.2 connector 0 Riser 2 power connector Front BP power connector 2 ThinkSystem HS350X V3 User Guide...
Table 7. System-board connectors (continued) Battery NVMe M.2 connector 1 MCIO 2 for riser 2 Front BP power connector 1 Fan 0 connector PIB signal connector Rear BP power connector MCIO 3 for riser 2 Fan 1 connector NCSI for PCIe NIC card MCIO 1 for NVMe SSD System board handle Fan 2 connector...
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Sets manufactory mode for BIOS. SW4–5 FM_ME_RCVR_N Recovers Intel ME. Bypasses the processor when running the ITP. SW4–6 FM_CPU0_SKTOCC_ SW4–7 BMC_XDP_JTAG_ Selects BMC JTAG to the processor or CPLD. SW4–8 FM_FORCE_ Forces power on for power measurement. PWRON_LVC3_R ThinkSystem HS350X V3 User Guide...
Table 8. SW4 switch block description (continued) Switch-bit Default position Description number Switch name SW4–9 PD_ADR_ Controls Asynchronous DRAM Refresh completion. COMPLETE SW4–10 HW_ASD_EN Enables At-Scale Debug. Troubleshooting by system LEDs and diagnostics display See the following section for information on available system LEDs and diagnostics display. LEDs and buttons on the front I/O module The front I/O module of the server provides control buttons, connectors, and LEDs.
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The power status LED helps you determine the current power status. There is another power button on DC-SCM on the rear, see “LEDs and buttons on Datacenter Secure Control Module (DC- SCM)” on page ThinkSystem HS350X V3 User Guide...
Status Color Description Solid on Power on. Slow blinking Power off, and the server is ready to be powered on (standby state). (about one flash per second) Green Fast blinking Power fault, or the server is waiting for BMC power permission to be ready. (about four flashes per second)
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“LEDs and buttons on the front I/O module” on page Status Color Description Solid on Green Power on. Slow blinking Green Power off, and the server is ready to be powered on (standby state). (about one flash per second) ThinkSystem HS350X V3 User Guide...
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Status Color Description Fast blinking Green Power fault, or the server is waiting for BMC power permission to be ready. (about four flashes per second) None There is no ac power applied to the server. UID button with UID LED Use this UID button and the blue UID LED to visually locate the server.
Connected to the VGA port on the front of DC-SCM, the VGA port on the side can be used with a cable plugged in. LEDs on the system board The following illustrations show the light-emitting diodes (LEDs) on the system board. ThinkSystem HS350X V3 User Guide...
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Description The FPGA error LED indicates the working status of FPGA. • Blinking (1Hz): A power fault error happens. • Off: No FPGA errors happen. Action If the FPGA error LED is lit, contact Lenovo Support. Chapter 2 Server components...
3. (Trained technicians only) If the problem remains, capture FFDC log, and replace the system board. 4. If the problem still remains, contact Lenovo Support. Catterr LED (red) Description The Catterr LED helps you identify if there are major errors happening within the system.
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LEDs on the front backplane Figure 11. LEDs on the front backplane Drive status LED Drive activity LED CPLD heartbeat LED Drive status LED Drive activity LED Table 10. Front drive LED description Drive Status Drive status LED (Orange) Drive activity LED (Green) The drive is not present.
When the power load increases, the standby power supply will switch to active state to provide sufficient power to the server. The power supply unit is updating online. Blinking (green, two flashes per second) ThinkSystem HS350X V3 User Guide...
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Status Description On (yellow) When the power supply unit is lit yellow: • Scenario 1: one of the two power supply units has powered off or is unplugged from the power cord, and at the same time, the other one has power on. •...
2. Click Parts. 3. Enter the serial number to view a listing of parts for your server. It is highly recommended that you check the power summary data for your server using Lenovo Capacity Planner before purchasing any new parts.
Tier 1 CRU at your request with no service agreement, you will be charged for the installation. • Tier 2 customer replaceable unit (CRU): You may install a Tier 2 CRU yourself or request Lenovo to install it, at no additional charge, under the type of warranty service that is designated for your server.
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• Power cords for this product that are used in the United States and Canada are listed by Underwriter's Laboratories (UL) and certified by the Canadian Standards Association (CSA). • For units intended to be operated at 230 volts (U.S. use): Use a UL-listed and CSA-certified cord set consisting of a minimum 18 AWG, Type SVT or SJT, three-conductor cord, a maximum of 15 feet in length and a tandem blade, grounding-type attachment plug rated 15 amperes, 250 volts.
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video, Information Technology and Communication Technology. Lenovo assumes that you are qualified in the servicing of equipment and trained in recognizing hazards energy levels in products. Access to the equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the authority responsible for the location.
• Make sure that the insulation is not frayed or worn. 3. Check for any obvious non-Lenovo alterations. Use good judgment as to the safety of any non-Lenovo alterations. 4. Check inside the server for any obvious unsafe conditions, such as metal filings, contamination, water or other liquid, or signs of fire or smoke damage.
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• When handling a device, carefully hold it by the edges or the frame. • Do not touch solder joints, pins, or exposed circuitry. • Keep the device from others’ reach to prevent possible damages. ThinkSystem HS350X V3 User Guide...
Memory module installation rules and order Memory modules must be installed in a specific order based on the memory configuration that you implement and the number of processors and memory modules installed in the server. Memory modules and processors layout The following illustration helps you to locate the memory module slots on the system board.
Refer to the below technical rules and limitations when you install the related server components. PCIe slots and adapters Understanding the technical rules for PCIe adapters helps you correctly install and configure PCIe adapters in the system. ThinkSystem HS350X V3 User Guide...
• Press and hold the power button for eight seconds to force a shutdown. When in a standby state, the server can respond to remote power-on requests sent to the BMC. For information about powering on the server, see “Power on the server” on page ThinkSystem HS350X V3 User Guide...
Server replacement Follow instructions in this section to remove and install the server. • “Remove the server from the rack” on page 41 • “Install the server to the rack” on page 44 Remove the server from the rack Follow instructions in this section to remove the server from the rack. S036 18 - 32 kg (39 - 70 lb) 32 - 55 kg (70 - 121 lb)
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Step 2. Use a screwdriver to loosen the captive screws and disengage the server from the rack. Figure 17. Disengaging the server from the rack Step 3. Slide the server out along the rails. ThinkSystem HS350X V3 User Guide...
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Figure 18. Pulling out the server Step 4. Remove the rails from the rack. Press and hold the blue button on the front end of the rail to release the front latch gripping the rack flange; then, slightly push the rail towards the rear until the pins disengage from the holes in the EIA flange.
“Safety inspection checklist” on page 34 to ensure that you work safely. • Power off the server and peripheral devices and disconnect the power cords and all external cables. See “Power off the server” on page ThinkSystem HS350X V3 User Guide...
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• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static- sensitive components in their static-protective packages until installation, and handling these devices with an electrostatic-discharge wrist strap or other grounding systems. CAUTION: Make sure to have three people operate the server installation procedures to prevent injury.
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If not, gently shake the rails until all the collars are visible in the mounting flange holes. Examine both ends to make sure the rails are secured. ThinkSystem HS350X V3 User Guide...
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Figure 25. Pins in square mounting flange holes Repeat the previous three steps on the other rail. Step 2. Install the server to the rails. Align and place the server onto the rails; then, slide it into the rack along the rails. Figure 26.
Remove the air baffle Follow instructions in this section to remove the air baffle. About this task The air baffle you want to remove might be different from following illustrations, but the removal method is the same. S033 ThinkSystem HS350X V3 User Guide...
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CAUTION: Hazardous energy present. Voltages with hazardous energy might cause heating when shorted with metal, which might result in spattered metal, burns, or both. S017 CAUTION: Hazardous moving fan blades nearby. Keep fingers and other body parts away. Attention: • Read “Installation Guidelines”...
The air baffle you want to install might be different from following illustrations, but the installation method is the same. S033 CAUTION: Hazardous energy present. Voltages with hazardous energy might cause heating when shorted with metal, which might result in spattered metal, burns, or both. S017 ThinkSystem HS350X V3 User Guide...
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CAUTION: Hazardous moving fan blades nearby. Keep fingers and other body parts away. Attention: • Read “Installation Guidelines” on page 33 “Safety inspection checklist” on page 34 to ensure that you work safely. • Power off the server and peripheral devices and disconnect the power cords and all external cables. See “Power off the server”...
For more details, see “Cable routing for front backplane power” on page 170 “Cable routing for front backplane signals” on page 171 If the cable connectors come with protective dust caps, make sure to put them back on. ThinkSystem HS350X V3 User Guide...
Step 3. Remove the backplane from the chassis. Figure 30. 3.5-inch drive backplane removal Loosen the screws that secure the backplane. Tilt the backplane and lift it out of the drive tray. After you finish If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.
“Remove the rear top cover” on page 156. Remove the air baffle. See “Remove the air baffle” on page Remove all installed drives from the drive bays. See “Remove a 2.5-inch hot-swap rear drive” on page ThinkSystem HS350X V3 User Guide...
Step 2. Record the cable connections for 2.5-inch rear drive and then disconnect all cables from the backplanes. For information about the backplane cable routing, see “Cable routing for rear drive backplane” on page 175. Step 3. Carefully lift the 2.5-inch rear drive backplane out of the rear hot-swap drive cage. Figure 32.
“Remove middle cable management arm (CMA)” on page 62 • “Install middle cable management arm (CMA)” on page 65 • “Remove bottom cable management arm (CMA)” on page 69 • “Install bottom cable management arm (CMA)” on page 74 ThinkSystem HS350X V3 User Guide...
Remove top cable management arm (CMA) Use this information to remove the top cable management arm (CMA). About this task S033 CAUTION: Hazardous energy present. Voltages with hazardous energy might cause heating when shorted with metal, which might result in spattered metal, burns, or both. S014 CAUTION: Hazardous voltage, current, and energy levels might be present.
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Disconnect all cables that go through the CMA to be removed. For more details about the cable routing, see “Cable routing for front backplane power” on page 170 “Cable routing for front backplane signals” on page 171. ThinkSystem HS350X V3 User Guide...
Step 8. Remove the CMA with cables attached. Figure 36. Removing the top CMA Use a screwdriver to remove the screws that lock top CMA. Lift the CMA up and remove it. After you finish If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.
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Connect all cables that go through the CMA. For more details about the cable routing, see “Cable routing for front backplane power” on page 170 “Cable routing for front backplane signals” on page 171. Step 4. Push the front drive tray back into position. ThinkSystem HS350X V3 User Guide...
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Figure 38. Folding the top CMA Step 5. Install the air baffle. See “Install the air baffle” on page Step 6. Install riser 1 and 2 assemblies. See “Riser card and PCIe adapter replacement” on page 140. Step 7. Install the front top cover to the server. Figure 39.
If the server is installed in a rack, remove the server from the rack. See “Remove the server from the rack” on page Step 2. Remove the rear top cover. See “Remove the rear top cover” on page 156. Step 3. Remove the front top cover. ThinkSystem HS350X V3 User Guide...
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Figure 40. Top cover removal Use a screwdriver to remove the screws that locks the front top cover. Lift the front cover up and remove it. Step 4. Remove riser 1 and 2 assemblies. See “Riser card and PCIe adapter replacement” on page 140.
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Remove front drives from the top drive tray. For front drive removal, see “Remove a 3.5-inch hot- swap front drive” on page Step 10. Remove the top drive tray to gain access to middle CMA. Figure 43. Removing top drive tray ThinkSystem HS350X V3 User Guide...
Press the latches on both sides to unlock the tray. Pull out the top tray. Step 11. Remove middle CMA with cables attached. Figure 44. Removing middle CMA Use a screwdriver to remove the screw that locks the middle CMA. Lift the middle CMA and remove it.
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Install the middle CMA. Figure 45. Installing middle CMA Lower the middle CMA into the chassis until both sides align the screw holes on the chassis. Use a screwdriver to install the screw to secure the middle CMA. ThinkSystem HS350X V3 User Guide...
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Step 3. Install top drive tray. Align the latches on both sides of the tray with chassis, and push it into the rails steadily. Figure 46. Installing top tray Step 4. Install front drives to the top drive tray. For front drive installation, see “Install a 3.5-inch hot-swap front drive”...
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Lower the front top cover onto the chassis until both sides of the top cover engage the guides on both sides of the chassis. Use a screwdriver to install the screws to secure the front top cover. ThinkSystem HS350X V3 User Guide...
Step 11. Install rear top cover. See “Install the rear top cover” on page 158. Step 12. Install the server into the racks. See “Install the server to the rack” on page After you finish After installing the top cover, complete the parts replacement. See “Complete the parts replacement”...
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Step 6. Pull out the front drive trays steadily to get access to top and middle CMAs. Figure 51. Extending top, middle and bottom CMAs Pull out bottom CMA first. Pull out middle CMA next. ThinkSystem HS350X V3 User Guide...
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Pull out top CMA. Step 7. Disconnect all cables that go through the CMAs to be removed. For more details about the cable routing, see “Cable routing for front backplane power” on page 170 “Cable routing for front backplane signals” on page 171.
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Step 12. Remove front drives from the middle drive tray. For front drive removal, see “Remove a 3.5-inch hot-swap front drive” on page Step 13. Remove the middle drive tray to gain access to bottom CMA. ThinkSystem HS350X V3 User Guide...
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Figure 55. Removing middle drive tray Press the latches on both sides to unlock the tray. Pull out the middle tray. Step 14. Remove the bottom CMA with cables attached. Figure 56. Removing bottom CMA Use a screwdriver to remove the screw that locks the bottom CMA. Lift the bottom CMA and remove it.
• All cables, adapters, and other components are installed and seated correctly and that you have not left loose tools or parts inside the server. • All internal cables are connected and routed correctly. See Chapter 5 “Internal cable routing” on page 169. Step 2. Install the bottom CMA. ThinkSystem HS350X V3 User Guide...
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Figure 57. Installing bottom CMA Lower the bottom CMA into the chassis until both sides align the screw holes on the chassis. Use a screwdriver to install the screws to secure the bottom CMA. Step 3. Install middle drive tray. Align the latches on both sides of the tray with chassis, and push it into the rails steadily.
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Figure 60. Installing top tray Step 7. Install front drives to the top drive tray. For front drive installation, see “Install a 3.5-inch hot-swap front drive” on page Step 8. Install the top CMA. ThinkSystem HS350X V3 User Guide...
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Figure 61. Installing the top CMA Lower the top CMA into the chassis until both sides align the screw holes on the chassis. Use a screwdriver to install the screws to secure the top CMA. Step 9. Connect all cables that go through the CMAs. For more details about the cable routing, see “Cable routing for front backplane power”...
The server supports two types of CMOS battery, refer to below sections to remove or install the battery delivered. • “Remove the CMOS battery” on page 78 • “Install the CMOS battery” on page 81 Remove the CMOS battery Use this information to remove the CMOS battery. ThinkSystem HS350X V3 User Guide...
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The following tips describe information that you must consider when removing the CMOS battery. • Lenovo has designed this product with your safety in mind. The lithium CMOS battery must be handled correctly to avoid possible danger. If you replace the CMOS battery, you must adhere to local ordinances or regulations for battery disposal.
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2. If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you. 3. Dispose of the CMOS battery as required by local ordinances or regulations. ThinkSystem HS350X V3 User Guide...
The following tips describe information that you must consider when installing the CMOS battery. • Lenovo has designed this product with your safety in mind. The lithium CMOS battery must be handled correctly to avoid possible danger. If you replace the CMOS battery, you must adhere to local ordinances or regulations for battery disposal.
Use this information to remove and install the Datacenter Secure Control Module (DC-SCM). • “Remove the Datacenter Secure Control Module (DC-SCM)” on page 83 • “Install the Datacenter Secure Control Module (DC-SCM)” on page 84 ThinkSystem HS350X V3 User Guide...
Remove the Datacenter Secure Control Module (DC-SCM) Follow the instructions in this section to remove the Datacenter Secure Control Module (DC-SCM). About this task Attention: • Read “Installation Guidelines” on page 33 “Safety inspection checklist” on page 34 to ensure that you work safely.
Press it down until it’s fully seated. Figure 69. DC-SCM installation Step 3. Install the top cover. See “Install the rear top cover” on page 158. After you finish ThinkSystem HS350X V3 User Guide...
Complete the parts replacement. See “Complete the parts replacement” on page 167. Fan cage and system fan replacement Use this information to remove and install a fan cage and system fan. • “Remove a fan cage” on page 85 • “Install a fan cage”...
Touch the static-protective package that contains the fan cage to any unpainted surface on the outside of the server. Then, take the fan cage out of the package and place it on a static-protective surface. Step 2. Install the fan cage. ThinkSystem HS350X V3 User Guide...
Figure 71. Fan cage installation Align the screw holes on the fan cage, middle wall and chassis. Tighten the screws to the middle wall. Step 3. Install the system fan. See “Install a system fan” on page Step 4. Install the air baffle. See “Install the air baffle”...
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Procedure Step 1. Remove the top cover. See “Remove the rear top cover” on page 156. ThinkSystem HS350X V3 User Guide...
Step 2. Grasp the fan tabs on both ends of the system fan and carefully lift the system fan out of the server. Figure 72. System fan removal Pinch the blue touch point on the system fan. Lift the system fan out of the fan cage. After you finish 1.
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Touch the static-protective package that contains the system fan to any unpainted surface on the outside of the server. Then, take the system fan out of the package and place it on a static- protective surface. ThinkSystem HS350X V3 User Guide...
Step 2. Install the system fan. Figure 73. System fan installation Pinch the blue touch point on the system fan. Install the system fan into the fan cage. Step 3. Install the top cover. See “Install the rear top cover” on page 158.
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“Install a heat sink Torx T30 nut” on page 2. If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you. ThinkSystem HS350X V3 User Guide...
Install a heat sink Torx T30 nut This task has instructions for installing a PEEK (Polyether ether ketone) Torx T30 nut on the heat sink. About this task Attention: • Read “Installation Guidelines” on page 33 “Safety inspection checklist” on page 34 to ensure that you work safely.
Step 1. Pull the drive tray out steadily until the drive to be removed is fully accessible. ThinkSystem HS350X V3 User Guide...
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Figure 76. Extending the drive tray Flip both tray locks to open position as the illustration shows. Pull the tray out steadily by the blue handle. Note: When pulling the tray out, pay attention to the cables that route though the cable management arm (CMA).
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static- sensitive components in their static-protective packages until installation, and handling these devices with an electrostatic-discharge wrist strap or other grounding systems. Procedure ThinkSystem HS350X V3 User Guide...
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Step 1. Touch the static-protective package that contains the hard drive to any unpainted surface on the outside of the server. Then, take the front drive out of the package and place it on a static- protective surface. Step 2. Assemble the hard drive and drive bracket.
• To ensure that there is adequate system cooling, do not operate the server for more than two minutes without either a drive or a drive filler installed in each bay. Procedure ThinkSystem HS350X V3 User Guide...
Step 1. Remove a hot-swap drive. Figure 82. Remove a hot-swap drive Slide the release latch to the left to open the drive tray handle. Open the drive handle. Slide the drive out of the drive bay. After you finish If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.
If the power supply unit to be removed is the only one installed, the power supply unit is not hot-swappable. Before removing it, you must turn off the server first. To support redundancy mode or hot-swap, install an additional hot-swap power supply unit. Safety information for AC power supplies ThinkSystem HS350X V3 User Guide...
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S035 CAUTION: Never remove the cover on a power supply or any part that has this label attached. Hazardous voltage, current, and energy levels are present inside any component that has this label attached. There are no serviceable parts inside these components. If you suspect a problem with one of these parts, contact a service technician.
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LED for the firstly replaced power supply unit is lit. For the location of the power output LED, refer to “The LED on the power supply unit” on page ThinkSystem HS350X V3 User Guide...
Step 2. Press the release tab toward the handle and carefully pull the handle at the same time to slide the hot-swap power supply unit out of the chassis. Figure 84. Hot-swap power supply removal Lift the pulling handle on the poser supply unit. Press the latch to the direction as shown.
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The device also might have more than one power cord. To remove all electrical current from the device, ensure that all power cords are disconnected from the power source. S001 ThinkSystem HS350X V3 User Guide...
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DANGER Electrical current from power, telephone, and communication cables is hazardous. To avoid a shock hazard: • Connect all power cords to a properly wired and grounded electrical outlet/source. • Connect any equipment that will be attached to this product to properly wired outlets/sources. •...
• If you are not installing a replacement memory module to the same slot, make sure you have memory module filler available. • Memory modules are sensitive to static discharge and require special handling. Refer to the standard guidelines for “Handling static-sensitive devices” on page ThinkSystem HS350X V3 User Guide...
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– Always wear an electrostatic-discharge strap when removing or installing memory modules. Electrostatic-discharge gloves can also be used. – Never hold two or more memory modules together so that they do not touch each other. Do not stack memory modules directly on top of each other during storage. –...
Then, take the memory module out of the package and place it on a static-protective surface. Step 3. Locate the required memory module slot on the processor board. Note: Ensure that you observe the installation rules and sequence in “Memory module installation rules and order” on page ThinkSystem HS350X V3 User Guide...
Step 4. Install the memory module into the slot. Figure 88. Memory module installation Attention: • Before you install a memory module into the slot, make sure that the clips are on open position, and the slot is clear of any debris. •...
Figure 89. M.2 cage removal Loosen the screw from the M.2 cage and chassis. Slide the cage to the direction as shown to disengage the cage from pins on the chassis and lift it out. After you finish ThinkSystem HS350X V3 User Guide...
If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you. Install an M.2 cage Follow instructions in this section to install an M.2 cage. About this task Attention: •...
169. Step 4. Remove the M.2 cage. See “Remove an M.2 cage” on page 110. Step 5. Remove the M.2 drive from the system board. Figure 91. M.2 drive (type 22110) removal ThinkSystem HS350X V3 User Guide...
Figure 92. M.2 drive (type 2280) removal Loosen the screw that secures the drive to the chassis. Lift the M.2 drive as the illustration shows. Disengage the M.2 drive from the system board. After you finish If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.
“Internal cable routing” on page 169. Step 7. Install the air baffle. See “Install the air baffle” on page Step 8. Install the top cover. See “Install the rear top cover” on page 158. After you finish ThinkSystem HS350X V3 User Guide...
Complete the parts replacement. See “Complete the parts replacement” on page 167. OCP module replacement Use this information to remove and install the OCP module. • “Remove the OCP module” on page 115 • “Install the OCP module” on page 116 Remove the OCP module Use this information to remove the OCP module.
Touch the static-protective package that contains the OCP module to any unpainted surface on the outside of the server. Then, take the OCP module out of the package and place it on a static- protective surface. ThinkSystem HS350X V3 User Guide...
Step 2. Install the OCP module. Notes: • Ensure that the Ethernet adapter is fully seated and the thumbscrew is securely tightened. Otherwise, the OCP module will not get full connection and may not function. • If there is an OCP module installed, when the system is powered off but still plugged in to AC power, system fan 1 and fan 2 will continue to spin at a much lower speed.
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“Remove a hot-swap power supply unit” on page 100. Step 3. Disconnect the cables attached to the PIB. For more details, see “Cable routing for power input board (PIB)” on page 173. Step 4. Remove the PIB. ThinkSystem HS350X V3 User Guide...
Figure 97. PIB removal Remove the screw that secure the PIB to the power supply unit cage. Lift the PIB upward first to release it from pins, and then lift it out of the chassis. After you finish If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.
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(PIB)” on page 173. Step 4. Install the power supply units, see “Install a hot-swap power supply unit” on page 103. After you finish Complete the parts replacement. See “Complete the parts replacement” on page 167. ThinkSystem HS350X V3 User Guide...
Processor and heat sink replacement Follow the instruction in this section to replace an assembled processor and heat sink, known as a processor-heat-sink module (PHM), a processor, or a heat sink. Attention: Before you begin replacing a processor, make sure that you have an alcohol cleaning pad and thermal grease.
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Clips to secure processor in carrier Heat sink triangular mark Carrier triangular mark Anti-tilt wire bail Processor ejector handle Nut and wire bail retainer Processor heat spreader Torx T30 nut Thermal grease Processor identification label Processor contacts ThinkSystem HS350X V3 User Guide...
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Processor carrier Processor triangular mark Clips to secure carrier to heat sink Procedure Step 1. Make preparations for this task. Remove the top cover. See “Remove the rear top cover” on page 156. Remove the air baffle. See “Remove the air baffle” on page Remove the fan cage.
Separate the processor from the heat sink and carrier. Figure 101. Separating a processor from the heat sink and carrier Note: Do not touch the contacts on the processor. Lift the handle to release the processor from the carrier. ThinkSystem HS350X V3 User Guide...
Hold the processor by its edges; then, lift the processor from the heat sink and carrier. Without putting the processor down, wipe the thermal grease from the top of the processor with an alcohol cleaning pad; then, place the processor on a static protective surface with the processor-contact side up.
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• PHMs are keyed for the socket where they can be installed and for their orientation in the socket. • Before you install a new PHM or replacement processor, update your system firmware to the latest level. The following illustration shows the components of the PHM. ThinkSystem HS350X V3 User Guide...
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Figure 103. PHM components Heat sink Clips to secure processor in carrier Heat sink triangular mark Carrier triangular mark Anti-tilt wire bail Processor ejector handle Nut and wire bail retainer Processor heat spreader Torx T30 nut Thermal grease Processor identification label Processor contacts Processor carrier Processor triangular mark...
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Press the processor and secure the sides under the clips on the carrier. Note: To prevent the processor from falling out of the carrier, keep the processor-contact side up and hold the processor-carrier assembly by the sides of the carrier. Step 3. Apply thermal grease. ThinkSystem HS350X V3 User Guide...
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Carefully place the processor and carrier in the shipping tray with the processor-contact side down. Make sure the triangular mark on the carrier is aligned with the triangular mark in the shipping tray. If there is any old thermal grease on the processor, gently wipe the top of the processor with an alcohol cleaning pad.
RAID flash power module replacement The RAID flash power module protects the cache memory on the installed RAID adapter. You can purchase a RAID flash power module from Lenovo. Use this information to remove and install a RAID flash power module.
Figure 108. Power cable routing for flash power module • Connect the RAID flash power module to the extension cable. • Connect the extension cable to the RAID adapter. • “Remove the RAID flash power module” on page 131 • “Install the RAID flash power module”...
Touch the static-protective package that contains the RAID flash power module to any unpainted surface on the outside of the server. Then, take the RAID flash power module out of the package and place it on a static-protective surface. ThinkSystem HS350X V3 User Guide...
Step 2. Install the RAID flash power module on the air baffle. Figure 110. Installation of the RAID flash power module on the air baffle Tilt the RAID flash power module and insert it into the clips on the air baffle. Press the RAID flash power module down to secure it into the air baffle.
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Figure 111. Rear wall cover removal Loosen the screws that secure the rear wall cover. Remove the cover from the rear wall. Step 5. Remove the rear drive cage. Figure 112. Rear drive cage removal ThinkSystem HS350X V3 User Guide...
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Loosen the screw that secures the rear drive cage from drive cage holder. Slide the cage to the direction as shown to unlock it from the holder, and lift it out of the chassis. Step 6. Remove the drive cage holder. Figure 113.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static- sensitive components in their static-protective packages until installation, and handling these devices with an electrostatic-discharge wrist strap or other grounding systems. ThinkSystem HS350X V3 User Guide...
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Procedure Step 1. Touch the static-protective package that contains the 2.5-inch rear drive cage to any unpainted surface on the outside of the server. And then, take the 2.5-inch rear drive cage out of the package and place it on a static-protective surface. Step 2.
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Tighten the screw to secure it to the chassis. Step 4. Before installing the rear drive cage, install the rear backplane first. See “Install the 2.5-inch rear drive backplane” on page Step 5. Install the rear drive cage. ThinkSystem HS350X V3 User Guide...
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Figure 117. Rear drive cage installation Align the guiding pins and a screw hole on both rear drive cage and holder, and slide the cage to the direction as shown to lock it to the holder. Tighten the screw to secure it to the holder. Step 6.
Procedure Step 1. Remove the top cover. See “Remove the rear top cover” on page 156. ThinkSystem HS350X V3 User Guide...
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Step 2. Remove riser 1 assembly. Figure 119. Riser assembly removal Step 3. Disconnect all cables that are routed to 9600-24i HBA or 9670-24i RAID adapter. For more information, see “Cable routing for 9600-24i HBA” on page 172 “Cable routing for 9670-24i RAID adapter”...
If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you. Install riser 1 assembly (HBA/RAID) Use this information to install the riser 1 assembly. ThinkSystem HS350X V3 User Guide...
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About this task The riser assembly you want to install might be different from the following illustrations, but the installation method is the same. Attention: • Read “Installation Guidelines” on page 33 “Safety inspection checklist” on page 34 to ensure that you work safely.
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Position the riser assembly on the chassis. Align the plastic clip and two pins on the bracket with the guide pin and two holes on the chassis. Then, carefully press the riser assembly straight down into the slot until it is fully seated. ThinkSystem HS350X V3 User Guide...
Figure 126. Riser assembly installation Step 6. Install the top cover. See “Install the rear top cover” on page 158. After you finish Complete the parts replacement. See “Complete the parts replacement” on page 167. Remove the riser 2 assembly Use this information to remove the riser 2 assembly.
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Grasp the PCIe adapter by its edges and carefully pull it out of the PCIe adapter slot on the riser card. Note: The procedure for removing a PCIe adapter is similar for different types of riser assembly. Step 5. Remove riser 2 card. ThinkSystem HS350X V3 User Guide...
Figure 129. Riser card removal Remove the screw that secure the riser card to the bracket. Slide the riser card to the left and remove it from the bracket. After you finish If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.
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• The power cable of riser 2 card routes through the clip on the air baffle. The signal cables route under the air baffle. • Connect the cables before installing the air baffle. To install an air baffle, see “Install the air baffle” on page Step 6. Install the riser 2 assembly. ThinkSystem HS350X V3 User Guide...
Follow instructions in this section to remove and install the system board. Important: This task must be operated by trained technicians that are certified by Lenovo Service. Do no attempt to remove or install it without proper training and qualification.
Step 2. Remove the system board from the chassis. Figure 133. System board removal Use a screwdriver to loosen the screws on two plungers. Slide the system board toward the front of the server, and lift it out of the chassis. After you finish Important: Before you return the system board, make sure that the processor socket is covered.
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Tighten the plunger screws. Use a screwdriver to tighten screws if necessary. After you finish 1. Install any components that you have removed from the failing system board assembly. • “Processor and heat sink” on page 121 ThinkSystem HS350X V3 User Guide...
• “Memory modules” on page 106 • “System fans” on page 85 • “Riser assemblies” on page 140 • “CMOS battery” on page 78 • “OCP module” on page 115 • “M.2 drive” on page 113 2. Properly route and secure the cables in the server. Refer to detailed cable routing information for each component in Chapter 5 “Internal cable routing”...
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“Install the front top cover” on page 155. 2. If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you. ThinkSystem HS350X V3 User Guide...
Install the front top cover Follow instructions in this section to install the front top cover. About this task S033 CAUTION: Hazardous energy present. Voltages with hazardous energy might cause heating when shorted with metal, which might result in spattered metal, burns, or both. S014 CAUTION: Hazardous voltage, current, and energy levels might be present.
Follow instructions in this section to remove the rear top cover. About this task S033 CAUTION: Hazardous energy present. Voltages with hazardous energy might cause heating when shorted with metal, which might result in spattered metal, burns, or both. ThinkSystem HS350X V3 User Guide...
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S014 CAUTION: Hazardous voltage, current, and energy levels might be present. Only a qualified service technician is authorized to remove the covers where the label is attached. Attention: • Read “Installation Guidelines” on page 33 “Safety inspection checklist” on page 34 to ensure that you work safely.
Note: A new top cover comes without a service label attached. If you need a service label, order it together with the new top cover and attach the service label to the new top cover first. Procedure Step 1. Check your server and ensure that: ThinkSystem HS350X V3 User Guide...
• All cables, adapters, and other components are installed and seated correctly and that you have not left loose tools or parts inside the server. • All internal cables are connected and routed correctly. See Chapter 5 “Internal cable routing” on page 169.
Disengage the TPM connector from DC-SCM. After you finish If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you. ThinkSystem HS350X V3 User Guide...
Install TPM Follow the instructions in this section to install TPM. About this task Attention: • Read “Installation Guidelines” on page 33 “Safety inspection checklist” on page 34 to ensure that you work safely. • Power off the server and peripheral devices and disconnect the power cords and all external cables. See “Power off the server”...
Figure 141. Removing VGA cable Use a flat-blade screwdriver (5mm in tip width) to loosen the screws that lock the VGA connector. Disengage the connector from the bracket. Pull the other connector off from the module. ThinkSystem HS350X V3 User Guide...
After you finish If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you. Install the VGA cable Follow instructions in this section to install the VGA cable on the DC-SCM. About this task Attention: •...
“Remove the riser 2 assembly” on page 145. Step 3. Remove the air baffle. See “Remove the air baffle” on page Step 4. Remove VRoC key. Remove the key with both hands as illustrated below, and unplug the key gently. ThinkSystem HS350X V3 User Guide...
Figure 143. VRoC key removal After you finish If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you. Install VRoC key Follow instructions in this section to install the VRoC key. About this task Attention: •...
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• supports RAID levels 0, 1, 5, and 10 • Requires an activation key Note: Intel VROC Standard and Premium listed above in the table are VRoC capacity offerings. The actual VRoC capacity depends on the model delivered. ThinkSystem HS350X V3 User Guide...
Complete the parts replacement Go through the checklist to complete parts replacement To complete the parts replacement, do the following: 1. Ensure that all components have been reassembled correctly and that no tools or loose screws are left inside your server. 2.
For backplane signal connection, see “Cable routing for front backplane signals” on page 171. • For the locations of backplane signal connectors on the system board, see “System-board connectors” on page 14 for details. ThinkSystem HS350X V3 User Guide...
Figure 145. Backplane power cable connection From Front BP power connector 1 Power and sideband connector on front backplane 1 Power and sideband connector on front backplane 2 Front BP power connector 2 Power and sideband connector on front backplane 3 Front BP power connector 3 Cable routing for front backplane signals In this section, you can find cable routing of front backplane signals.
HBA C1 Slimline 0 and 1 connectors on front backplane 3 HBA C2 Cable routing for 9670-24i RAID adapter This section offers the cable routing between front drive backplanes with Broadcom 9670-24i 05-50123-00 Tri RAID. ThinkSystem HS350X V3 User Guide...
Figure 147. Cable routing for front backplanes and an HBA From Slimline 0 and 1 connectors on front backplane 1 RAID C0 Slimline 0 and 1 connectors on front backplane 2 RAID C1 Slimline 0 and 1 connectors on front backplane 3 RAID C2 Cable routing for power input board (PIB) Use the section to understand the power and signal cable routing for the power input board (PIB).
Use the section to understand the cable routing for RAID flash power modules. For the location of the connector on the RAID flash power module, refer to “RAID flash power module replacement” on page 130 for details. ThinkSystem HS350X V3 User Guide...
Figure 149. Cable routing for RAID flash power module From RAID flash power module RAID flash power port on RAID adapters Cable routing for rear drive backplane Use the section to understand the power and signal cable routing for the rear drive backplane. For the locations of backplane power and signal connectors on the system board, see “System-board connectors”...
Use the section to understand the power and signal cable routing for the riser 2 card. For the locations of riser 2 card power and signal connectors on the system board, see “System-board connectors” on page 14 for details. ThinkSystem HS350X V3 User Guide...
Figure 151. Cable routing for riser 2 card From MCIO 0 and 1 connector on riser 2 card MCIO 2 for riser 2 1–1 MCIO 3 for riser 2 1–2 Power connector on riser 2 card Riser 2 power connector Cable routing for system fans Use the section to understand the cable routing for system fans.
Cable routing for VGA and front panel Use the section to understand the cable routing for VGA and the front panel. For the locations of front panel connector on the system board, see “System-board connectors” on page 14 for details. ThinkSystem HS350X V3 User Guide...
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Figure 153. Cable routing for VGA and front panel From VGA port on the rear of the server VGA connector on DC-SCM Front panel Front panel connector Chapter 5 Internal cable routing...
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(TBW). A device that has exceeded this limit might fail to respond to system-generated commands or might be incapable of being written to. Lenovo is not responsible for replacement of a device that has exceeded its maximum guaranteed number of program/erase cycles, as documented in the Official Published Specifications for the device.